AN ANALYTICAL APPROACH FOR BUCKLING BEHAVIOR OF TEMPERATURE-DEPENDENT LAMINATED PIEZOELECTRIC FUNCTIONALLY GRADED PLATES UNDER THERMO-ELECTRO-MECHANICAL LOADINGS AND DIFFERENT END SUPPORTS

摘要

In this paper, we examine the buckling behavior of piezoelectric laminated plate made of two-layered functionally graded materials (FGMs) that are integrated with surface-bonded piezoelectric actuators and is subjected to a combined action of uniform temperature change, inplane forces, and applied actuator voltage. Temperature-dependent material properties are assumed for both the substrate FGM layer and piezoelectric layers. Employing an analytical approach, five coupled governing stability equations, which were derived based on the first-order shear deformation plate theory, are converted into a fourth-order and a second-order decoupled partial differential equations. Then, an accurate analytical solution is proposed to solve them. Parametric studies are also undertaken, and show the effects of applied actuator voltage, volume fraction exponents, plate aspect ratio, ratio of piezoelectric layer thickness to thickness of FGM layer and temperature dependency, on the buckling load of the plate.