The surface quality of monocrystalline silicon cutting using fixed abrasive diamond endless wire saw

摘要

This paper investigates the cutting of monocrystalline silicon using a fixed abrasive diamond endless wire. The cut surface of monocrystalline silicon is studied. The higher the wire speed, the better the surface quality and monocrystalline silicon was removed in a brittle regime mainly. The effects of wire speed and feed rate on the surface roughness are investigated. This study demonstrates the advantage of fixed abrasive diamond endless wire cutting of monocrystalline silicon.