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首页> 外文期刊>International journal of applied electromagnetics and mechanics >Investigation of a vacuum packaged MEMS gyroscope architecture's temperature robustness
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Investigation of a vacuum packaged MEMS gyroscope architecture's temperature robustness

机译:真空封装MEMS陀螺仪架构的温度稳定性研究

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摘要

A novel method is investigated in this paper to estimate the temperature's influence upon the resonant frequency (RESF) and quality factor (Q) of a vacuum packaged Micro-Electro-Mechanical-System (MEMS) gyroscope, which can give suggestions to improve the architecture's temperature robustness. The dual-mass decoupled gyroscope's architecture is introduced, and the drive and sense modes' mechanical character are analyzed. The models of RESF and damping are established, and the influence factors are investigated. Four samples are tested and the results indicate that the models can estimate and evaluate the tendency of the RESF and Q in different temperature. The investigation also considers the Young Modulus is the dominate element influencing RESF and increasing the thickness and width of the U-shaped spring can decrease this influence; Q is impacted mainly by the air viscosity coefficient and ambient pressure. The errors of the models are caused by manufacture error and the air getter's influence.
机译:本文研究了一种新颖的方法来估算温度对真空封装的微机电系统(MEMS)陀螺仪的谐振频率(RESF)和品质因数(Q)的影响,该建议可为改进体系结构提供建议温度鲁棒性。介绍了双质量解耦陀螺仪的结构,并分析了驱动模式和传感模式的机械特性。建立了RESF和阻尼模型,并研究了影响因素。测试了四个样本,结果表明该模型可以估计和评估RESF和Q在不同温度下的趋势。研究还认为,杨氏模量是影响RESF的主要因素,增加U形弹簧的厚度和宽度可以减小这种影响。 Q主要受空气粘度系数和环境压力的影响。模型的误差是由制造误差和吸气剂的影响引起的。

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