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Fabrication and Characterization of MFISFET using CMOS Process for Single Transistor Memory Application

机译:CMOS工艺用于单晶体管存储应用的MFISFET的制造与表征

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Metal Ferroelectric Insulator Semiconductor Fieid Effect Transistors (MHSFET) were fabricated using CMOS process. The PZT/TiO_2 combined layer was used as a gate dielectric layer of MFISFET device. The memory window of p type MFISFET was about 2.5 V. The threshold voltages of p-MHSFET and n-MFISFET are -1.8 V and 3.8V, respectively. The Id-Vd characteristic shows a nonvolatile memory function through write and read operation. The retention property of p-MFISFET is examined by reading drain currents after writing to gate. About 15 percent reduction in the drain current is observed when it is read after 100 minutes.
机译:使用CMOS工艺制造了金属铁电绝缘体半导体场效应晶体管(MHSFET)。将PZT / TiO_2组合层用作MFISFET器件的栅极介电层。 p型MFISFET的存储窗口约为2.5V。p-MHSFET和n-MFISFET的阈值电压分别为-1.8 V和3.8V。 Id-Vd特性通过写和读操作显示了非易失性存储功能。通过在写入栅极后读取漏极电流来检查p-MFISFET的保持特性。 100分钟后读取时,观察到漏极电流降低了约15%。

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