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首页> 外文期刊>Infrared physics and technology >Post-etching mesa surface composition investigation of InAs/GaSb type-II strained layer superlattices using XPS characterization
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Post-etching mesa surface composition investigation of InAs/GaSb type-II strained layer superlattices using XPS characterization

机译:利用XPS表征研究InAs / GaSb II型应变层超晶格的蚀刻后台面表面成分

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XPS characterization was used to determine the surface chemistry of a mid-wave infrared T2SL treated by both an HCl-based and an H3PO4-based etching solution. This analysis, performed over both the etched and unetched portions of the sample, revealed that the HCl-based etch removed Ga and Sb oxides while the H3PO4-based etch removed In and As oxides. XPS imaging was also done on 200 pm x 200 mu m areas of the sample, and showed that HCl solution (Ga, and 0) produced surfaces that were less stoichiometric than the H3PO4 solution (Ga2O3, Sb2O5, Sb in GaSb). Single-pixel, p-i-n test structures were fabricated using either etching solution, and an electrical comparison revealed over an order of magnitude improvement in dark current for the sample treated with the H3PO4 solution, compared to the HCl sample. (C) 2014 Elsevier B.V. All rights reserved.
机译:XPS表征用于确定通过HCl和H3PO4蚀刻溶液处理的中波红外T2SL的表面化学性质。对样品的蚀刻部分和未蚀刻部分进行的分析表明,基于HCl的蚀刻去除了Ga和Sb氧化物,而基于H3PO4的蚀刻去除了In和As氧化物。 XPS成像也是在200 pm x 200微米的样品区域上进行的,显示HCl溶液(Ga和0)产生的表面化学计量比H3PO4溶液(Ga2O3,Sb2O5,Sb在GaSb中)低。使用任一种蚀刻溶液制造单像素p-i-n测试结构,与HCl样品相比,用H3PO4溶液处理的样品的电比较显示暗电流改善了一个数量级。 (C)2014 Elsevier B.V.保留所有权利。

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