首页> 外文期刊>電子情報通信学会技術研究報告. 集積回路. Integrated Circuits and Devices >Development of 60-GHz-band dielectric waveguide filter and investigation of flip-chip package structure
【24h】

Development of 60-GHz-band dielectric waveguide filter and investigation of flip-chip package structure

机译:60 GHz频段介质波导滤波器的研制及倒装芯片封装结构研究

获取原文
获取原文并翻译 | 示例

摘要

A planar dielectric waveguide filter with CPW I/O ports suitable for flip-chip bonding is proposed and is demonstrated for 60-GHz-band applications. The filter is formed incorporating metalized through holes in an alumina substrate. In order to improve stop-band rejection, short-circuited CPW resonators with a half wavelength are added to waveguide-to-CPW transitions. A fabricated 4-resonator filter exhibits an insertion loss of 3.2 dB with a 3 dB-bandwidth of 3.0 GHz at a center frequency of 59.5 GHz. The filter is mounted by using flip-chip bonding in a multi-layer ceramic package with a structure to suppress parasitically propagating electromagnetic waves. The flipped filter shows a stop-band rejection better than 35 dB from 50 GHz to 80 GHz.
机译:提出了一种适用于倒装芯片键合的具有CPW I/O端口的平面介质波导滤波器,并针对60 GHz频段应用进行了演示。过滤器是在氧化铝基板上由金属化通孔形成的。为了改善阻带抑制,在波导到CPW的转换中增加了具有半波长的短路CPW谐振器。在59.5 GHz中心频率下,预制的4谐振器滤波器的插入损耗为3.2 dB,3 dB带宽为3.0 GHz。该滤波器采用倒装芯片键合安装在多层陶瓷封装中,其结构可抑制寄生传播的电磁波。翻转滤波器在50 GHz至80 GHz范围内显示出优于35 dB的阻带抑制。

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号