Resurgence in Japan’s Semiconductor Industry – Part 2: Post-Process Materials Take on Ever-Increasing Importance

摘要

Along with the pre-process of forming circuits on the silicon wafer, growing importance now is being placed on the post-process in semiconductor manufacturing, which involves cutting out the semiconductor chip, lining the wires across it and then inserting the chip into its package. With the limits to what can be done in semiconductor downsizing drawing nearer and nearer, it will be such technological developments in packaging that hold the key to improved performance.