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首页> 外文期刊>Physica, B. Condensed Matter >A survey on crystallization kinetic behavior of direct current magnetron sputter deposited NiTi thin films
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A survey on crystallization kinetic behavior of direct current magnetron sputter deposited NiTi thin films

机译:直流磁控溅射沉积Niti薄膜结晶动力学行为的调查

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The purpose of this work is to assess the crystallization kinetic properties of the direct current (DC) magnetron sputtered NiTi thin films. NiTi thin films were deposited on NaCl substrate using a magnetron sputtering method. Differential scanning calorimetry (DSC) was employed at different heating rates of 5, 20, and 30 K min-1 to investigate the crystallization kinetic behavior. Only one dominant peak emerged during amorphous-crystalline transformation at different heating rates. The activation energy values during crystallization were 321.81, 288.86, and 234.56 kJ mol-1 at heating rates of 5, 20, and 30 K min-1, respectively. The average value of the Avrami exponent for the studied films was 2.2. The predominant mechanisms governing the nucleation and growth processes were continuous nucleation and diffusion-controlled two-dimensional growth. We envisage that the results of this systematic work will create new paradigms and opportunities in industrial-scale applications of NiTi films in microelectrochemical systems.
机译:本工作的目的是评估直流磁控溅射NiTi薄膜的结晶动力学特性。采用磁控溅射法在NaCl衬底上制备了NiTi薄膜。采用差示扫描量热法(DSC)在5、20和30 K min-1的不同加热速率下研究了结晶动力学行为。在不同升温速率下,非晶转变过程中只出现一个主峰。在加热速率为5、20和30 kmin-1时,结晶过程中的活化能值分别为321.81、288.86和234.56 kJ mol-1。研究薄膜的Avrami指数平均值为2.2。控制成核和生长过程的主要机制是连续成核和扩散控制的二维生长。我们设想,这项系统工作的结果将为NiTi薄膜在微电子化学系统中的工业规模应用创造新的范例和机会。

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