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机译:用于3D IC应用的超高强度(111) - 料和纳米掺杂纳米晶体Cu的电沉积
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
Doctech Ltd Taichung 402 Taiwan;
Resound Technol Inc Kaohsiung 806 Taiwan;
Resound Technol Inc Kaohsiung 806 Taiwan;
Southern Univ Sci &
Technol Dept Mat Sci &
Engn Shenzhen Peoples R China;
Natl Chung Hsing Univ Dept Chem Engn Taichung 402 Taiwan;
Univ Hong Kong Dept Mech Engn Pokfulam Rd Hong Kong Peoples R China;
direct current; electrodeposition; nanocrystalline Cu; ultrahigh strength; superfilling;
机译:通过表面蠕变在Cu-To-Cu接头中获得高机械强度的固态方法(111) - 纳米多克蛋白Cu
机译:超高强度[111]取向NiTiHfPd单晶的超弹性响应和阻尼能力
机译:纳米级孪晶Cu,通过直流电沉积制备的超高强度
机译:用于3D IC封装的(111)首选取向纳米孪晶Cu UBM上界面IMC的生长机理
机译:用于3D-IC包装的微型凸点中多孔Cu3Sn金属间化合物的形成机理
机译:(111)定向和纳米孪晶铜的结合界面微观结构与铜-铜接头的剪切强度之间的相关性
机译:金属合金Cu表面钝化导致用于3D IC和异构整合应用的高质量细间距凸块Cu-Cu键合
机译:Cu(111)在水溶液和超高真空中的比较:光学二次谐波产生研究。 (重新公布新的可用性信息)