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Analysis of chip size distribution using image processing technology to estimate wear state of cylindrical grinding wheel

机译:利用图像处理技术分析芯片尺寸分布,以升降圆柱磨轮磨损状态

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In theory, the chip shape distribution changes with the wearing of a grinding wheel in both suface and cylindrical grinding processes. However, the relationship between the chip shape distribution and wear has not been verified experimentally and quantitatively under any of the grinding techniques. To this end, in this work, chips from repeated cylindrical grinding processes are collected. It is noted that the workpiece surface becomes rougher with each repetition. The images of the individual chips, obtained using a particle tracking system are analyzed, and the results indicate that the proportion of small chips and slender chips, respectively known as melted and flow chips, increases when the grinding wheel is worn, which is in contrast to the implications of the established theory.
机译:理论上,在表面磨削和外圆磨削过程中,切屑形状分布随砂轮磨损而变化。然而,在任何磨削技术下,切屑形状分布与磨损之间的关系尚未得到实验和定量验证。为此,在这项工作中,从重复的外圆磨削过程中收集切屑。值得注意的是,每重复一次,工件表面就会变得更粗糙。对使用颗粒跟踪系统获得的单个切屑的图像进行了分析,结果表明,当砂轮磨损时,小切屑和细长切屑(分别称为熔化切屑和流动切屑)的比例增加,这与已建立理论的含义相反。

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