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Nano-scale elastic-plastic properties and indentation-induced deformation of amorphous silicon carbide thin film

机译:纳米尺度弹性塑料性能和压痕诱导的非晶硅薄膜变形

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摘要

Controllable low-temperature (500 degrees C) deposition of amorphous a-SiC ceramic films on Si(100) was achieved using a pulsed dc-magnetron puttering system in a mixture of CH4/Ar. The nanoscale elastic-plastic response of the film upon contact loading was systematically characterized and analyzed by depth sensing nanoindentation technique using a Berkovich tip indenter. The mean values for elastic modulus and hardness were found to be 170 +/- 10 and 11.0 +/- 0.8 GPa, respectively. The onset of elastic-plastic transition occurred with contact loading of 70 mu N at a depth of 10 nm. By coupling the Hertzian contact theory and Johnson's cavity model, the critical shear stress (7.7 GPa), yielding strength (14.4 GPa), plastic zone size (30-300 nm), and plastic work ratio (0.18-0.40) of a-SiC thin film under nanoindentation were determined. Based on the experimental results, the resolved shear stress analysis and deformation behavior were found to be consistent with the interpretation that the deformation behavior was associated with local readjustment of small clusters of atoms. The deformation mechanism was also explained on the basis of shear transformation zones (STZs) amorphous plasticity theory.
机译:在CH 4 / Ar的混合物中,使用脉冲DC-磁控调节系统实现Si(100)上的无定形A-SiC陶瓷膜的可控低温(500摄氏度)沉积。通过使用Berkovich Tip压头系统的深度感测纳米狭窄技术来系统地表征和分析膜上的纳米级弹性塑料响应。弹性模量和硬度的平均值分别为170 +/- 10和11.0 +/- 0.8GPa。弹性塑料过渡的发病发生,接触载荷为70μN,深度为10nm。通过耦合赫兹联系理论和约翰逊的腔模型,临界剪切应力(7.7GPa),屈服强度(14.4GPa),塑料区尺寸(30-300nm)和A-SiC的塑料工作比(0.18-0.40)确定薄膜下的薄膜。基于实验结果,发现已解析的剪切应力分析和变形行为与解释一致,即变形行为与局部调整的小簇的局部调整相关。还基于剪切变换区(STZS)非晶塑性理论来解释变形机制。

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