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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Electrical Characteristic Analysis and Device Simulation of Polycrystalline Silicon Thin-Film Transistors
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Electrical Characteristic Analysis and Device Simulation of Polycrystalline Silicon Thin-Film Transistors

机译:多晶硅薄膜晶体管的电特性分析与装置模拟

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摘要

I will report electrical characteristic analysis and device simulation of polycrystalline silicon thin-film transistors (poly-Si TFTs). First, as for the electrical characteristic analysis, I will explain extraction techniques of trap densities at front- and back-insulator interfaces and grain boundaries, and I will report extraction results of actual devices. Next, using the device simulation, I will investigate dependence of transistor characteristics on the trap densities, and based on the simulation results, I will evaluate actual transistor characteristics. Finally, I will introduce simulation results about dependence of current-voltage characteristics on grain boundary location, electric field profile around grain boundaries with surface roughness, current paths in poly-Si films and current density enhancement at poly-Si edges.
机译:我将报告多晶硅薄膜晶体管(Poly-Si TFT)的电特性分析和装置模拟。 首先,对于电学特性分析,我将解释前后绝缘子接口和晶界的陷阱密度的提取技术,我将报告实际设备的提取结果。 接下来,使用设备仿真,我将研究晶体管特性对陷阱密度的依赖性,并基于仿真结果,我将评估实际的晶体管特性。 最后,我将介绍仿真结果关于电流 - 电压特性对晶界位置上的电流电压特性的依赖性,具有表面粗糙度的晶界周围的电场轮廓,多Si膜中的电流路径和多Si边缘的电流密度增强。

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