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Highly reliable Pd-based ohmic contacts of p-type InP

机译:高度可靠的P型InP欧姆触点

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摘要

Low resistance and highly reliable Sb/Zn/Pd Ohmic contacts to p-type InP were developed. PdZn contacts with a few nm thick Sb first layer provided excellent reproducibility and a wide annealing temperature range to produce low resistances. The minimum contact resistivity of 7×10{sup}(-5) Ωcm{sup}2 was obtained for the Sb(3 nm)/Zn(20 nm)/Pd(20 nm) contacts after annealing at temperature ranging from 375°C to 400°C for 2 mm. The diffusion depth of the contact metals into the InP substrate was less than 50 nm, which was about 10 times shallower than that of the conventional AuZn contacts.
机译:开发出对P型InP的低电阻和高度可靠的Sb / Zn / Pd欧姆触点。 具有几NM厚的SB第一层的PDZN触点提供了出色的再现性和宽的退火温度范围,以产生低电阻。 在以375°的温度范围内退火后,对于Sb(3nm)/ Zn(20nm)/ pd(20nm)触点获得的最小接触电阻率为7×10 {sup}( - 5)Ωcm{sup} 2 C至400°C 2毫米。 接触金属的扩散深度进入INP基板小于50nm,比传统的Auzn触点的浅约10倍。

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