Toshibas third voluntary plan (voluntary environmental action plan) includes the theme of lead reduction. Based on this plan, we have been expanding the application of lead-free soldering to products since fiscal 2000. In fiscal 2002 and 2003, we investigated reflow/flow lead-free soldering technology to expand its application, the Sn-Zn soldering process to widen the process margin, and lead-free solder coating technology for the leads of electronic devices to make completely lead-free products. We have also applied reliability design technology, a diagnosis system for lead-free soldering processes, and a skill education system for lead-free soldering to the manufacturing scheme.
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