无铅有铅混装焊接技术

摘要

针对板级组装过程中出现的有铅无铅混装情况，介绍了无铅混装焊接带来的问题，主要是有铅焊料与无铅元器件以及有铅元器件与无铅元器件之间兼容性问题；针对两种材料熔点差异，需要焊接温度参数调整，提出了设置兼容性温度曲线的解决办法，同时详细说明了兼容性温度曲线优化实验及可靠性验证结果。%Aiming at the situation of mixed assembly with lead-free and lead materials, introduce the problem brought by mixed assembly. The primary problem is compatibility between lead and lead-free. Because of difference of melting point between the two materials, need to change the temperature profile. Put forward the effective method to set the compatibility temperature profile. At the same time, give out the optimized temperature profile and the reliability verification results with experiment.