Phase Stabilities of Stable beta- and yetastable beta'- Cu4Ti Intermetallic Compounds in The Cu-Ti-Ni System : a Density Functional Theory Study

摘要

Cu is widely used as an electronic circuit component because of its high conductivity. However, in order to be used as connector materials, high strength as well as the high conductivity is required to maintain the desired shape. Since pure Cu is a soft material, it is essential to increase the strength of Cu for use as a connector. To obtain high strength of Cu alloy, we can use various strengthening methods such as dispersion, solid solution, and precipitation hardening methods. Among them, the precipitation hardening is the most effective to realize high strength of ~ 1GPa.