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首页> 外文期刊>Journal of Ceramic Science and Technology >Effect of Multiple loading sequence on in-phase thermomechanical fatigue hysteresis of silicon carbide fiber-reinforced ceramic-matrix composites
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Effect of Multiple loading sequence on in-phase thermomechanical fatigue hysteresis of silicon carbide fiber-reinforced ceramic-matrix composites

机译:多加载序列对碳化硅纤维增强陶瓷 - 基质复合材料同步热机械疲劳滞后的影响

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In this paper, the effect of multiple loading sequence on the in-phase (IP) thermomechanical fatigue (TMF) hysteresis of silicon carbide fiber-reinforced ceramic-matrix composites (SiC-CMCs) has been investigated. Considering the coupling effects of multiple loading sequence, thermal cyclic temperature and applied cycle number, the fiber/matrix interface damage lengths have been determined based on the thermomechanical micromechanical stress field and fracture mechanics method. The relationships between the in-phase TMF hysteresis loops, multiple loading sequence, thermal cyclic temperature and fiber/matrix interface damage state have been established. The in-phase TMF stress/ strain hysteresis loops and fiber/matrix interface damage state for different composite material properties, peak stress with different loading sequence and damage state have been discussed. The comparisons of the in-phase TMF stress/ strain hysteresis loops and fiber/matrix interface damage between single peak stress and multiple loading sequence have been analyzed. The TMF stress/strain hysteresis loops and fiber/matrix interface damage state of 2D SiC/SiC composite subjected to low-high three loading sequences have been predicted. Under TMF multiple loading sequence, the fiber/matrix interface slip lengths are larger than those under TMF single peak stress, leading to the increase of TMF stress/strain hysteresis loops area, peak and residual strain, and the decrease of hysteresis modulus.
机译:本文研究了多重加载序列对碳化硅纤维增强陶瓷 - 基质复合材料(SiC-CMC)的同相(IP)热机械疲劳(TMF)滞后的影响。考虑到多加载序列,热循环温度和施加循环数的耦合效果,基于热机械微机械应力场和断裂力学方法确定了光纤/矩阵界面损坏长度。已经建立了相位TMF滞后环,多加载序列,热循环温度和光纤/矩阵界面损坏状态之间的关系。已经讨论了不同复合材料特性的同相TMF应力/应变滞后环和纤维/基质界面损伤状态,已经讨论了不同装载序列和损坏状态的峰值应力。已经分析了单峰应力和多重加载序列之间的相位TMF应力/应变滞后环和纤维/基质界面损伤的比较。已经预测了经受低高三装序列的2D SiC / SiC复合材料的TMF应力/应变滞后环和纤维/基质界面损伤状态。在TMF多加载序列下,光纤/基质界面滑动长度大于TMF单峰值应力下的纤维间应力,导致TMF应力/应变滞后环的增加,峰值和残余应变,以及滞后模量的降低。

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