首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >All-sputtered oxide thin-film transistors fabricated at 150 degrees C using simultaneous ultraviolet and thermal treatment
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All-sputtered oxide thin-film transistors fabricated at 150 degrees C using simultaneous ultraviolet and thermal treatment

机译:所有溅射氧化物薄膜晶体管,使用同时紫外线和热处理在150℃下制造

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摘要

In this study, we report all-sputtered In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) through the fabrication of a sputtered gate insulator. Furthermore, using simultaneous UV and thermal (SUT) treatment, we fabricate sputter-processed gate insulators at a low temperature of 150 degrees C with a higher amount of coordinated oxygen species and a higher surface energy than thermal-only (300 degrees C) treated gate insulators. Additionally, by activating the IGZO channel layer using SUT treatments, we fabricate all-sputter processed IGZO TFTs at 150 degrees C and they exhibit improved device performances compared to thermal-only treated ones; the field-effect mobility is increased from 7.32 +/- 3.8 to 29.59 +/- 2.5 cm(2) V-1 s(-1), the on/off ratio is increased from (1.1 +/- 1.8) x 10(5) to (2.9 +/- 1.7) x 10(8), and the subthreshold swing is decreased from 1.0 +/- 0.07 to 0.4 +/- 0.05 V dec(-1).
机译:在这项研究中,我们通过制造溅射栅极绝缘体来报告全溅射的内部-Ga-Zn-O(IGZO)薄膜晶体管(TFT)。 此外,使用同时UV和热(SUT)处理,我们在低温为150℃的低温下制造溅射加工的栅极绝缘体,比仅热(300摄氏度)的氧气物质和更高的表面能量,所述溅射氧 门绝缘子。 另外,通过使用SUT处理激活IGZO沟道层,我们在150摄氏度下制造全溅射处理的IGZO TFT,与唯一的热处理的处理相比,它们表现出改进的装置性能; 现场效应移动性从7.32 +/- 3.8增加到29.59 +/- 2.5 cm(2)V-1 s(-1),从(1.1 +/- 1.8)x 10增加( 5)至(2.9 +/- 1.7)x 10(8),亚阈值摆幅从1.0 +/- 0.07减少到0.4 +/- 0.05 V Dec(-1)。

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