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Neutron transmutation doping technology of silicon and overview of trial irradiations at Cirus Reactor

机译:硅的中子trans变掺杂技术及Cirus Reactor的试验辐射概述

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摘要

Neutron Transmutation Doped Silicon (NTD-Si) has been used extensively in manufacturing of high power semiconductor devices. The quality of NTD-Si, both from view points of dopant concentration and homogeneity has been found superior to the quality of doped silicon produced by conventional methods. The technology of NTD-Si has been perfected to achieve more accurate resistivity and homogeneous resistivity with complete elimination of hot spots. In addition, the greater spatial uniformity, as well as the precise control over the resistivity achievable by using the NTD process, has led to a substantial increase in the breakdown voltage capability of thyristors. The report describes the fundamentals of NTD-Si production and discusses various techniques used for control of dopant concentration and homogeneity. Various aspects like radiation damage, residual radio-activity, nuclear heating, surface contamination and annealing requirements of the silicon ingots after irradiation have also been discussed. Details of toil irradiation and characterization of NTD-Si samples have been provided. Future plans for production of NTD-Si in Cirus and Dhruva reactors have also been discussed.
机译:中子掺杂硅(NTD-Si)已被广泛用于制造高功率半导体器件。从掺杂剂浓度和均匀性的角度来看,NTD-Si的质量均优于通过常规方法生产的掺杂硅的质量。 NTD-Si技术已经过完善,可在完全消除热点的情况下实现更精确的电阻率和均质电阻率。此外,更大的空间均匀性以及通过使用NTD工艺可实现的电阻率的精确控制,已导致晶闸管的击穿电压能力大幅提高。该报告描述了NTD-Si生产的基本原理,并讨论了用于控制掺杂剂浓度和均匀性的各种技术。还讨论了辐射损伤,残余放射性,核加热,表面污染以及辐照后硅锭的退火要求等各个方面。提供了详细的劳动照射和NTD-Si样品表征的信息。还讨论了在Cirus和Dhruva反应堆中生产NTD-Si的未来计划。

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