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Effects of Sb on the Charge Transport and Power Factor of Bi2-xSbxTe3 Thermoelectric Compounds Prepared by Hot Pressing

机译:Sb对热压制备的Bi2-XSBXTE3热电化合物电荷运输和功率因数的影响

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摘要

We report the effects of Sb content on the charge transport and power factor of Bi2-xSbxTe3(1.56 <= x <= 1.74) compounds prepared by hot pressing. From the temperature-dependence of the electrical conductivity, it was found that the charge transport in the compounds was predominantly governed by acoustic phonon scattering, and additionally affected by ionized impurity scattering. Hole concentration increased with increasing Sb content due to the generation of antisite defects, and its process-dependence is discussed in comparison with our previous work. The room-temperature mobility of the compound gradually decreased with increasing Sb content due to the intensification of ionized impurity scattering by the antisite defects, however, the effect of grain boundary scattering on the mobility could not be observed. The Seebeck coefficient decreased with the increase in Sb content, and this effect was interpreted in terms of the carrier concentration and the density-of-state (DOS) effective mass. The DOS effective mass was estimated by Pisaernko relation, and it increased from 0.75 (x = 1.56) to 0.97 (x = 1.74) with increasing Sb content due to the non-parabolicity in the valence band of Bi2-xSbxTe3. Based on these results, the effects of Sb content on the power factor were discussed, and the highest power factor of 37.2 x 10(4) Wm(-1)K(-2) was obtained in the Bi0.3Sb1.7Te8 compound at room temperature.
机译:我们报告了Sb含量对通过热压制备的Bi2-Xsbxte3(1.56 <= <= 1.74)化合物的电荷传输和功率因数的影响。从导电率的温度依赖性,发现化合物中的电荷传输主要受声学声子散射的管,并且通过电离杂质散射的另外影响。由于产生防易缺陷而增加,孔浓度随着Sb含量的增加而增加,与我们以前的工作相比,其过程依赖性讨论。随着通过抗烧伤缺陷的电离杂质散射的强化,化合物的室温迁移率随着Sb含量的增加而逐渐降低,但是,不能观察到晶界散射对迁移率的影响。随着Sb含量的增加,塞贝克系数降低,并且在载流子浓度和状态密度(DOS)有效质量方面解释了这种效果。 Pisaernko关系估计了DOS有效质量,并且由于BI2-Xsbxte3的价带中的非剖析性,从0.75(x = 1.56)增加到0.97(x = 1.74)。基于这些结果,讨论了Sb含量对功率因数的影响,并在BI0.3SB1.7Te8化合物中获得了37.2×10(4)Wm(-1)k(-2)的最高功率因数室内温度。

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