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Thermoelectric Properties of Cu-doped Bi2-xSbxTe3 Prepared by Encapsulated Melting and Hot Pressing

机译:通过封装熔化和热压制备Cu掺杂Bi2-Xsbxte3的热电性能

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摘要

P-type Bi2-xSbxTe3:Cu-m (x = 1.5-1.7 and m = 0.002-0.003) solid solutions were synthesized using encapsulated melting and were consolidated using hot pressing. The effects of Sb substitution and Cu doping on the charge transport and thermoelectric properties were examined. The lattice constants decreased with increasing Sb and Cu contents. As the amount of Sb substitution and Cu doping was increased, the electrical conductivity increased, and the Seebeck coefficient decreased owing to the increase in the carrier concentration. All specimens exhibited degenerate semiconductor characteristics and positive Hall and Seebeck coefficients, indicating p-type conduction. The increased Sb substitution caused a shift in the onset temperature of the intrinsic transition and bipolar conduction to higher temperatures. The electronic thermal conductivity increased with increasing Sb and Cu contents owing to the increase in the carrier concentration, while the lattice thermal conductivity slightly decreased due to alloy scattering. A maximum figure of merit, ZT(max) = 1.25, was achieved at 373 K for Bi0.4Sb1.6Te3:Cu-0.003.
机译:P型Bi2-Xsbxte3:Cu-m(x = 1.5-1.7和m = 0.002-0.003)使用包封的熔化合成固溶体,并使用热压固结。检查了Sb取代和Cu掺杂对电荷传输和热电性能的影响。随着Sb和Cu含量的增加,晶格常数降低。随着Sb取代和Cu掺杂的量增加,导电率增加,由于载体浓度的增加,塞贝克系数降低。所有标本都表现出退化的半导体特性和正展厅和塞贝克系数,表明p型传导。增加的Sb取代导致本质转变和双极传导的起始温度转变为更高的温度。由于载流子浓度的增加,由于载流子浓度的增加,电子导热率随着Sb和Cu的含量而增加,而晶格导热率由于合金散射而略微降低。在Bi0.4SB1.6Te3:Cu-0.003的373k,实现了最大优异的优选图ZT(MAX)= 1.25。

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