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Low-stress diamond films deposited on stainless steel by a two-step dropped power process in chemical vapor deposition

机译:在化学气相沉积中通过两步滴电源过程沉积在不锈钢上的低应力金刚石薄膜

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AbstractA continuous low-stress diamond film has been prepared on stainless steel by a novel two-step dropped power process using a Cr/CrN/CrTiAlN film as an interlayer. After the interlayer was deposited on the stainless steel, isolated diamond particles were firstly prepared under high power of 1800W for 10min in CVD, which has low stress, releasing most of thermal stress. Then, the low power of 1500W was adopted to form continuous diamond films. The stress is obviously lower than that of the continuous diamond film deposited only in the first CVD process, indicating that the two-step dropped power process surely decreases the internal stress of the film. The blocky microstructure on sandblasted stainless steel is beneficial to releases the stress. And the existence of very small amount of pores in the diamond film also benefits the stress releasing.Graphical abstractA novel two-step dropped power process in chemical vapor deposition was proposed to prepare low stress diamond film on stainless steels.Display OmittedHighlights?A novel two-step dropped power is proposed to deposit a low stress diamond film.?Isolated diamond particles releases most of the stress from high power to low power.?The formed blocky structure benefits stress accommodation.?A Cr/CrN/CrTiAlN interlayer block iron outward diffusion and carbon inward diffusion]]>
机译:<![cdata [ 抽象 通过新颖的两步掉落的电源工艺进行了不锈钢的连续低音钻石薄膜作为中间层的Cr / CrN / CrTialn薄膜。在中间层沉积在不锈钢上之后,首先在1800W的高功率下制备分离的金刚石颗粒,在CVD中具有低应力,释放大部分热应力。然后,采用1500W的低功率形成连续金刚石薄膜。应力明显低于仅在第一CVD工艺中沉积的连续金刚石薄膜的应力,表明两步掉落的电源过程可靠地降低薄膜的内应力。喷砂不锈钢上的块状微观结构有利于释放应力。并且在金刚石膜中存在非常少量的孔也有益于压力释放。 图形抽象 提出了一种新型的化学气相沉积中的两步掉落功率过程,以制备不锈钢上的低应力金刚石薄膜。 显示省略 突出显示 < c:list id =“l0005”> 一部小说提出了两步掉落的功率,以沉积低应力钻石膜。 隔离的金刚石粒子将大部分压力从高功率释放到低功率。 形成的块结构受益住宿。 a cr / CRN / CRTialn层间块铁向外扩散和碳向内扩散 ]]>

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