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A comparative study of direct current magnetron sputtering and high power impulse magnetron sputtering processes for CNX thin film growth with different inert gases

机译:具有不同惰性气体的CNX薄膜生长的直流磁控溅射和高功率脉冲磁控溅射工艺的对比研究

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Reactive direct current magnetron sputtering (DCMS) and high power impulse magnetron sputtering (HiPIMS) discharges of carbon in different inert gas mixtures (N-2/Ne, N-2/Ar, and N-2/Kr) were investigated for the growth of carbon-nitride (CNX) thin films. Ion mass spectrometry showed that energies of abundant plasma cations are governed by the inert gas and the N-2-to-inert gas flow ratios. The population of ion species depends on the sputter mode; HiPIMS yields approximately ten times higher flux ratios of ions originating from the target to process gas ions than DCMS. Exceptional are discharges in Ne with N-2-to-Ne flow ratios <20%. Here, cation energies and the amount of target ions are highest without influence on the sputter mode. CNX thin films were deposited in 14% N-2/inert gas mixtures at substrate temperatures of 110 degrees C and 430 degrees C. The film properties show a correlation to the substrate temperature, the applied inert gas and sputter mode. The mechanical performance of the films is mainly governed by their morphology and composition, but not by their microstructure. Amorphous and fullerene-like CN0.14 films exhibiting a hardness of similar to 15 GPa and an elastic recovery of similar to 90% were deposited at 110 degrees C in reactive Kr atmosphere by DCMS and HiPIMS. (C) 2016 Elsevier B.V. All rights reserved.
机译:对不同惰性气体混合物(N-2 / NE,N-2 / AR和N-2 / KR)进行了反应性直接电流磁控溅射(DCMS)和高功率脉冲磁控溅射(HIPIMS)碳的碳排出量(N-2 / NE,N-2 / AR和N-2 / KR)进行生长碳 - 氮化物(CNX)薄膜。离子质谱表明,丰富的等离子体阳离子的能量受到惰性气体和N-2 - 惰性气体流量比的管辖。离子物种的群体取决于溅射模式; Hipims产生源自靶的离子的助焊剂比率大约是处理气体离子的大约10倍。卓越的NE在N-2对NE流量比率<20%的情况下排出。这里,阳离子能量和靶离子的量最高而不会影响溅射模式。 CNX薄膜在110℃和430℃的底物温度下沉积在14%N-2 /惰性气体混合物中。膜性能显示与基板温度,施加的惰性气体和溅射模式的相关性。电影的机械性能主要由它们的形态和组成来控制,而不是它们的微观结构。具有类似于15GPa的硬度的无定形和富勒烯样CN0.14薄膜和类似于90%的弹性回收率通过DCM和HIPIM在110℃下以110℃沉积90%。 (c)2016年Elsevier B.v.保留所有权利。

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