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Effect of Etching Time on Optical and Thermal Properties of p-Type Porous Silicon Prepared by Electrical Anodisation Method

机译:刻蚀时间对电阳极氧化法制备p型多孔硅光学性能和热性能的影响

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The porous silicon (PSi) layers were formed on p-type silicon (Si) wafer. The six samples were anodised electrically with 30 mA/cm2 fixed current density for different etching times. The structural, optical, and thermal properties of porous silicon on silicon substrates were investigated by photoluminescence (PL), photoacoustic spectroscopy (PAS), and UV-Vis-NIR spectrophotometer. The thickness and porosity of the layers were measured using the gravimetric method. The band gap of the samples was measured through the photoluminescence (PL) peak and absorption spectra, then they were compared. It shows that band gap value increases by raising the porosity. Photoacoustic spectroscopy (PAS) was carried out for measuring the thermal diffusivity (TD) of the samples.
机译:在p型硅(Si)晶片上形成多孔硅(PSi)层。将六个样品以30 mA / cm2的固定电流密度电阳极氧化,以实现不同的蚀刻时间。通过光致发光(PL),光声光谱法(PAS)和UV-Vis-NIR分光光度计研究了硅基底上多孔硅的结构,光学和热学性质。使用重量分析法测量层的厚度和孔隙率。通过光致发光(PL)峰和吸收光谱测量样品的带隙,然后进行比较。它表明带隙值通过提高孔隙率而增加。进行光声光谱法(PAS)以测量样品的热扩散率(TD)。

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