首页>
外国专利>
ETCHING SOLUTION FOR ETCHING POROUS SILICON, ETCHING METHOD USING THE ETCHING SOLUTION AND METHOD OF PREPARING SEMICONDUCTOR METHOD USING THE ETCHING SOLUTION
ETCHING SOLUTION FOR ETCHING POROUS SILICON, ETCHING METHOD USING THE ETCHING SOLUTION AND METHOD OF PREPARING SEMICONDUCTOR METHOD USING THE ETCHING SOLUTION
展开▼
机译:用于蚀刻多孔硅的蚀刻溶液,使用该蚀刻溶液的蚀刻方法以及使用该蚀刻溶液的半导体方法的制备方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for preparing a semiconductor member comprises: forming a substrate having a non-porous silicon monocrystalline layer and a porous silicon layer; bonding another substrate having a surface made of an insulating material to the surface of the monocrystalline layer; and etching to remove the porous silicon layer by immersing in an etching solution.
展开▼