Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

Jang Keon‐Soo; Eom Yong‐Sung; Choi Kwang‐Seong; Bae Hyun‐Cheol

摘要

Abstract > For electrical interconnections in semiconductor packaging, epoxy‐based pastes have recently attracted considerable interest due to their excellent adhesion to various substrates and their reasonable electrical and mechanical properties, especially when combined with deoxidizing agents (to remove metallic oxides). Here, epoxy–diacid‐based hybrid pastes were examined to achieve a deoxidizing capability for eliminating Sn‐based solder oxides and adhesion between microchip and substrate as a one‐step process. Onset, exothermic peak and end temperatures of the reaction between epoxy and diacids were systematically probed using DSC, rheometry and Fourier transform infrared (FTIR) spectroscopy. The last moment of the adhesive reaction during heating substantially enhanced the thermal and mechanical properties of the epoxy–diacid adhesive despite the absence of exothermic enthalpy detected by DSC. The glass transition temperature ( <fi>T</fi> <sub>g</sub> ) and Young's modulus gradually decreased as a function of aliphatic chain length of diacids except when the length was extremely short and voids were produced. Soldering (wetting) and deoxidizing capabilities of the hybrid adhesive were observed via optical microscopy and FTIR. The correlation between the reaction, <fi>T</fi> <sub>g</sub> , conversion and viscosity was also investigated. Lastly, complete wetting and electrical interconnection with good mechanical robustness were achieved for a commercial chip/substrate set by flip‐chip bonding. ? 2018 Society of Chemical Industry </abstract> </span> <span class="z_kbtn z_kbtnclass hoverxs" style="display: none;">展开▼</span> </div> <div class="translation abstracttxt"> <span class="zhankaihshouqi fivelineshidden" id="abstract"> <span>机译：</span><Abstract XMLNS =“http://www.wiley.com/namespaces/wiley”type =“main”xml：lang =“en”> <标题类型=“main”>抽象</ title> > 对于半导体封装中的电互连，由于它们对各种基材的优异粘附以及它们合理的电气和机械性能，因此最近引起了基于环氧基的糊状物，特别是当与脱氧剂结合（以除去金属氧化物）。在此，检查环氧树脂 - 二酸的杂交浆料，以实现用于消除SN基焊料氧化物的脱氧能力和微芯片和基材之间的粘附作为一步法。使用DSC，流变学和傅立叶变换红外（FTIR）光谱系统探测了环氧树脂和二酸之间反应的放热峰值和最终温度。尽管没有通过DSC检测到的放热焓，但加热过程中粘合剂反应的最后一刻基本上增强了环氧二二酸粘合剂的热量和机械性能。玻璃化转变温度（ <fi> t </ fi> <sub> g </ sub> ）杨氏模量随着二酸的脂族链长度的函数而逐渐降低，除非时长度非常短，产生空隙。通过光学显微镜和FTIR观察杂交粘合剂的焊接（润湿）和脱氧能力。反应之间的相关性， <fi> t </ fi> <sub> g </ sub> 还研究了转化和粘度。最后，通过倒装芯片键合的商业芯片/基板实现了具有良好机械稳健性的完全润湿和电互连。还2018年化学工业学会 </ p> </摘要> </span> <span class="z_kbtn z_kbtnclass hoverxs" style="display: none;">展开▼</span> </div> </div> <div class="record"> <h2 class="all_title" id="enpatent33" >著录项</h2> <ul> <li> <span class="lefttit">来源</span> <div style="width: 86%;vertical-align: text-top;display: inline-block;"> <a href='/journal-foreign-29710/'>《Polymer international》</a> <b style="margin: 0 2px;">|</b><span>2018年第9期</span><b style="margin: 0 2px;">|</b><span>共7页</span> </div> </li> <li> <div class="author"> <span class="lefttit">作者</span> <p id="fAuthorthree" class="threelineshidden zhankaihshouqi"> <a href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=Jang Keon‐Soo&option=202" target="_blank" rel="nofollow">Jang Keon‐Soo;</a> <a href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=Eom Yong‐Sung&option=202" target="_blank" rel="nofollow">Eom Yong‐Sung;</a> <a href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=Choi Kwang‐Seong&option=202" target="_blank" rel="nofollow">Choi Kwang‐Seong;</a> <a href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=Bae Hyun‐Cheol&option=202" target="_blank" rel="nofollow">Bae Hyun‐Cheol;</a> </p> <span class="z_kbtnclass z_kbtnclassall hoverxs" id="zkzz" style="display: none;">展开▼</span> </div> </li> <li> <div style="display: flex;"> <span class="lefttit">作者单位</span> <div style="position: relative;margin-left: 3px;max-width: 639px;"> <div class="threelineshidden zhankaihshouqi" id="fOrgthree"> <p>ICT Materials and Components Research LaboratoryElectronics and Telecommunications Research Institute (ETRI)Daejeon South Korea;</p> <p>ICT Materials and Components Research LaboratoryElectronics and Telecommunications Research Institute (ETRI)Daejeon South Korea;</p> <p>ICT Materials and Components Research LaboratoryElectronics and Telecommunications Research Institute (ETRI)Daejeon South Korea;</p> <p>ICT Materials and Components Research LaboratoryElectronics and Telecommunications Research Institute (ETRI)Daejeon South Korea;</p> </div> <span class="z_kbtnclass z_kbtnclassall hoverxs" id="zhdw" style="display: none;">展开▼</span> </div> </div> </li> <li > <span class="lefttit">收录信息</span> <span style="width: 86%;vertical-align: text-top;display: inline-block;"></span> </li> <li> <span class="lefttit">原文格式</span> <span>PDF</span> </li> <li> <span class="lefttit">正文语种</span> <span>eng</span> </li> <li> <span class="lefttit">中图分类</span> <span><a href="https://www.zhangqiaokeyan.com/clc/1185.html" title="高分子化学（高聚物）">高分子化学（高聚物）;</a></span> </li> <li class="antistop"> <span class="lefttit">关键词</span> <p style="width: 86%;vertical-align: text-top;"> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=adhesive&option=203" rel="nofollow">adhesive;</a> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=deoxidizing (fluxing)&option=203" rel="nofollow">deoxidizing (fluxing);</a> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=crosslink&option=203" rel="nofollow">crosslink;</a> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=metal oxides&option=203" rel="nofollow">metal oxides;</a> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=electrical interconnection&option=203" rel="nofollow">electrical interconnection;</a> <a style="color: #3E7FEB;" href="/search.html?doctypes=4_5_6_1-0_4-0_1_2_3_7_9&sertext=aliphatic diacids&option=203" rel="nofollow">aliphatic diacids;</a> </p> <div class="translation"> 机译：粘合剂;脱氧（助熔剂）;交联;金属氧化物;电互连;脂肪族二酸; </div> </li> </ul> </div> </div> <div class="literature cardcommon"> <div class="similarity "> <h3 class="all_title" id="enpatent66">相似文献</h3> <div class="similaritytab clearfix"> <ul> <li class="active" >外文文献</li> <li >中文文献</li> <li >专利</li> </ul> </div> <div class="similarity_details"> <ul > <li> <div> <b>1. </b><a class="enjiyixqcontent" 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