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Porous copper structures produced by PIM and space holder technique

机译:PIM和空间支架技术产生的多孔铜结构

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A number of processes have been developed over the past two decades for the manufacture of micro copper structures used in heat pipes because of their good thermal conductance and capillary force properties. However, the processes used such as machining or lithography have relatively low production rates. H Cho and S J Park, at Pohang University of Science and Technology in Korea, recently reported on research to mass produce micro copper heat pipes using Powder Injection Moulding at the World PM2016 Congress [as reviewed in Powder Injection Moulding International, Vol. 11, No 1, March 2017, pp 86-87], stating that PIM is a promising route for producing micro copper heat pipes because of its ability to achieve the required total pipe thickness of less than 0.6 mm with a wall thickness of around 0.1 mm - 0.2 mm.
机译:过去二十年来制造了许多工艺,用于制造热管中使用的微铜结构,因为它们具有良好的热导流和毛细管力特性。 然而,诸如加工或光刻等的过程具有相对较低的生产率。 韩国科技大学的H Cho和S J Park最近报道了在世界PM2016国会世界PM2016国会使用粉末注射成型的大规模生产微型铜热管[如粉末注射成型国际,VOL。 11,2017年3月1日,PP 86-87],PIM是生产微铜热管的有希望的途径,因为其能够达到壁厚约0.1的壁厚的所需总管厚度小于0.1 mm - 0.2 mm。

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