首页> 外文期刊>Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion >Interplay of annealing temperature and doping in hole selective rear contacts based on silicon-rich silicon-carbide thin films
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Interplay of annealing temperature and doping in hole selective rear contacts based on silicon-rich silicon-carbide thin films

机译:基于富含硅碳化硅薄膜的孔选择性后触点的退火温度和掺杂的相互作用

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We present a detailed optimization of a hole selective rear contact for p-type crystalline silicon solar cells which relies on full-area processes and provides full-area passivation. The passivating hole-contact is based on a layer stack comprising a chemically grown thin silicon oxide, an intrinsic silicon interlayer, and an in-situ boron doped non-stoichiometric silicon-rich silicon-carbide layer on top. After deposition, the structure is annealed at 775-900 degrees C to diffuse dopant impurities to the c-Si wafer and a hydrogenation step is carried out. It is shown that hydrogenation is essential to obtain high quality surface passivation. In particular, we compare the effect of annealing in forming gas and annealing with a silicon-nitride overlayer as hydrogen source. We present a systematic optimization of the hole-selective contact, for which we varied the doping concentration, annealing parameters and report the implied open circuit voltage (iV(oc)) and combined specific contact resistivity (p(c)). It is observed that for highly doped layers the optimum annealing temperature for high quality surface passivation is 800 degrees C while for lowly doped layers the optimum annealing condition shifts to 850 degrees C. Excellent surface passivation and efficient current transport is evidenced by an iV(oc) value of 718 mV which corresponds to a saturation current density (J(0)) of 11.5 fA/cm(2) and a p(c) of 17 mg Omega cm(2) on p-type wafers. Moreover, the evolution of the boron diffusion profiles with different annealing conditions is investigated. Finally, we demonstrate proof-of concept p-type hybrid solar cells employing the full-area hole-selective rear contact presented here and standard heterojunction front electron contact. The excellent efficiency potential of our passivating rear contact is highlighted by conversion efficiencies up to of 21.9%, enabling V-oc of 708 mV, FF of 79.9% and J(sc) of 38.7 mA/cm(2).
机译:我们对P型晶体硅太阳能电池的孔选择性后接触提供了详细优化,该硅太阳能电池依靠全面积工艺并提供全面积钝化。钝化孔触点基于包括化学生长的薄氧化硅,固有硅中间层和原位硼掺杂的非化学计量的非化学计量富含硅碳化硅层的层堆叠。沉积后,该结构在775-900℃下退火,以扩散掺杂剂杂质与C-Si晶片,并进行氢化步骤。结果表明,氢化是必不可少的,以获得高质量的表面钝化。特别地,我们比较退火在形成气体中的效果和用氮化硅叠层作为氢源的退火。我们介绍了孔选择性接触的系统优化,我们改变了掺杂浓度,退火参数并报告隐含的开路电压(IV(OC))和组合的特定接触电阻率(P(C))。观察到,对于高质量表面钝化的高度掺杂层的最佳退火温度为800℃,而对于差低掺杂层,最佳退火条件偏移到850℃。IV的优异表面钝化和有效的电流传输可以证明(OC )值为718 mV,其对应于在p型晶片上的11.5 fa / cm(2)和17mg Omega cm(2)的AP(c)的饱和电流密度(j(0))。此外,研究了具有不同退火条件的硼扩散谱的演化。最后,我们展示了采用这里呈现的全区域孔选择后接触的概念P型混合太阳能电池和标准异质结前电子触点。我们钝化后接触的优异效率潜力突出显示,转化效率高达21.9%,使V-OC为708 mV,FF为79.9%,j(sc)为38.7 mA / cm(2)。

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