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Experimental investigations on super-smooth polishing of strontium titanate based ceramics substrates

机译:基于钛酸锶锶晶体基材超光滑抛光的实验研究

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摘要

Strontium titanate (SrTiO_3) is a new type of multi-function electronic ceramic material. SrTiO_3 ceramic substrates with a high dielectric constant can be obtained by non-pressurised sintering using ultrathin blanks, which result in the characteristics of thin, soft, brittle and warped. So that SrTiO_3 ceramics substrates need to be polished to improve surface quality and dimensional precision before application. In this research, polish experiments with various processing parameters on the surface roughness, the material removal rate and the surface morphologies of SrTiO_3 ceramic substrates were conducted. The results show that the SrTiO_3 ceramic substrate with a highest quality surface was obtained in the condition: employing a brown polyurethane pad to polish the substrates at a polishing velocity of 45 r/min. Meanwhile, the slurry flow rate, the concentration of the polishing slurry and the polishing pressure were 20 ml/min, 4 wt% and 15.043 kPa, respectively, which rates with an overall and a partial surface roughness of Ra 0.01 μm and Ra 4 nm, respectively. While some new micro-scratches were generated on the surface of the SrTiO_3 ceramics substrate in the polishing process because the embedding and scratching of abrasive particle led to expose the inherent pores and grain boundaries.
机译:钛酸锶(SRTIO_3)是一种新型多功能电子陶瓷材料。具有高介电常数的SRTIO_3陶瓷基材可以通过使用超级坯料的非加压烧结获得,从而导致薄,柔软,脆性和翘曲的特性。因此,需要抛光SRTIO_3陶瓷基板以提高应用前提高表面质量和尺寸精度。在该研究中,进行了对表面粗糙度的各种加工参数的波兰实验,进行了SRTIO_3陶瓷基板的材料去除率和表面形态。结果表明,在条件下获得具有最高质量表面的SRTIO_3陶瓷基材:采用棕色聚氨酯垫以45 r / min的抛光速度抛光基板。同时,浆料流速,抛光浆料的浓度和抛光压力分别为20mL / min,4wt%和15.043kPa,其总体和α01μm和ra 4 nm的部分表面粗糙度率, 分别。虽然在抛光过程中,在SRTIO_3陶瓷基板的表面上产生一些新的微划痕,因为磨料和擦除磨粒LED以暴露固有的孔和晶界。

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