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Surface defects generated by intrinsic origins on 4H-SiC epitaxial wafers observed by scanning electron microscopy

机译:通过扫描电子显微镜观察到的4H-SIC外延晶片上的内在起源产生的表面缺陷

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摘要

Surface defects with intrinsic origins in an epitaxial layer on 4H-SiC wafers were observed by scanning electron microscopy. Commercially available 4H-SiC epitaxial wafers with 4 degrees or 8 degrees off-axis angles from the [0001] direction toward the [11 (2) over bar0] direction were used in this experiment. Various types of defects, including micropipes, pits, carrots, stacking faults and wide terrace and high step structures, were observed and clearly identified. The defects are presented as a catalog that can be used in the identification of surface defects.
机译:通过扫描电子显微镜观察到在4H-SiC晶片上的外延层中具有内在起源的表面缺陷。 在该实验中使用了从[0001]方向上的4度或8度的市售的4H-SiC外延晶片,从[0001]方向上有4个或8度的轴角。 观察并清楚地识别了各种类型的缺陷,包括微观泄漏,坑,胡萝卜,堆叠故障和宽阔的露台和高步结构。 缺陷呈现为可用于识别表面缺陷的目录。

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