Representative volume element analysis for wafer-level warpage using Finite Element methods (vol 91, pg 392, 2019)

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• 来源
  《Materials science in semiconductor processing》 |2019年第2019期|共2页
• 作者

  Baek Jong Won; Yang Woo Seok; Hur Min Jae; Yun Jin Chul; Park Seong Jin;

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• 作者单位

  Pohang Univ Sci &

  Technol POSTECH Dept Mech Engn 77 Cheongam Ro Pohang 37673 Gyeongbuk South Korea;

  Pohang Univ Sci &

  Technol POSTECH Dept Mech Engn 77 Cheongam Ro Pohang 37673 Gyeongbuk South Korea;

  SK Hynix Proc Technol Comp Aided Design R&

  D Team 2091 Gyeongchung Daero Icheon Si 17336 Gyeonggi Do South Korea;

  SK Hynix Proc Technol Comp Aided Design R&

  D Team 2091 Gyeongchung Daero Icheon Si 17336 Gyeonggi Do South Korea;

  Pohang Univ Sci &

  Technol POSTECH Dept Mech Engn 77 Cheongam Ro Pohang 37673 Gyeongbuk South Korea;

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• 原文格式 PDF
• 正文语种 eng
• 中图分类 半导体技术;
• 关键词