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N-type silicon nanowires prepared by silver metal-assisted chemical etching: Fabrication and optical properties

机译:通过银金属辅助化学蚀刻制备的N型硅纳米线:制造和光学性质

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摘要

This paper reports the fabrication of silicon nanowires (SiNWs) by silver (Ag) metal-assisted chemical etching (MACE) method. N-type Si (100) wafers, doped with phosphorus with the resistivity from 1 divided by 10 Omega x cm, were selected for sample preparation. Ag particles of about 30 nm in diameter, which were used as the catalytic metal, were aggregated on the surface of the Si wafer immersed in HF (4.6 M) and AgNO3 solution, with the variation concentration of 15-35 mM, for one minute. Consequently, the Si wafers covered with Ag particles were etched in HF (4.8 M) and H2O2 (0.4 M) solution for the formation of vertically aligned SiNWs. We found that the size and density of SiNWs decreased with the increase of AgNO3 concentration. After a delay time of about 30-40 min, the SiNWs growth depended linearly on the etching time. The light emission from the prepared SiNWs observed at room temperature was well resolved with two bands at around 450 nm (similar to 2.75 eV) and 700 nm (similar to 1.77 eV). The origins of the two emission bands and the comparative aspects are presented and discussed.
机译:本文报道了银纳米线(SINW)的制造通过银(Ag)金属辅助化学蚀刻(术术)。选择N型Si(100)晶片,掺杂具有从1除以10ωxcm的电阻率的磷,用于样品制备。直径约30nm的Ag颗粒在浸入HF(4.6M)和AgNO 3溶液中的Si晶片的表面上聚集,变异浓度为15-35mm,一分钟。因此,用Ag颗粒覆盖的Si晶片在HF(4.8M)和H 2 O 2(0.4M)溶液中蚀刻以形成垂直对齐的SINW。我们发现,随着AgNO3浓度的增加,SINW的尺寸和密度降低。在约30-40分钟的延迟时间之后,SINWS生长在蚀刻时间线性地依赖于蚀刻时间。在室温下观察到的制备SINW的光发射良好地用两个带,约450nm(类似于2.75eV)和700nm(类似于1.77eV)。呈现和讨论了两个发射带和比较方面的起源。

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