Speed Enhancement for the 3rd-Generation Direct Liquid Cooling Power Modules for Automotive Applications with RC-IGBT

摘要

Fuji Electric has employed a thin reverse-conducting IGBT (RC-IGBT) in the development of a 3rd-generation direct liquid cooling module for automotive applications that is characterized by its high-speed packaging structure. By utilizing an RC-IGBT that integrates an IGBT and FWD on a single chip, the module achieves faster switching at turn-on and turn-off. In addition, parasitic inductance has been decreased by 50% compared with conventional packages through use of the RC-IGBT and internal layout optimization. Furthermore, superimposed surge voltage has been reduced by adopting a packaging structure that equips all 3 phases with a PN terminal pair. These technologies have enabled the 3rd-generation module to reduce switching loss by 30% compared with 2nd-generation modules.