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Record mobility in transparent p-type tin monoxide films and devices by phase engineering

机译:通过相工程技术记录透明p型一氧化锡薄膜和器件中的迁移率

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Here, we report the fabrication of nanoscale (15 nm) fully transparent p-type SnO thin film transistors (TFT) at temperatures as low as 180 C with record device performance. Specifically, by carefully controlling the process conditions, we have developed SnO thin films with a Hall mobility of 18.71 cm~2 V~(-1) s~(-1) and fabricated TFT devices with a linear field-effect mobility of 6.75 cm~2 V~(-1) s ~(-1) and 5.87 cm~2 V~(-1) s~(-1) on transparent rigid and translucent flexible substrates, respectively. These values of mobility are the highest reported to date for any p-type oxide processed at this low temperature. We further demonstrate that this high mobility is realized by careful phase engineering. Specifically, we show that phase-pure SnO is not necessarily the highest mobility phase; instead, well-controlled amounts of residual metallic tin are shown to substantially increase the hole mobility. A detailed phase stability map for physical vapor deposition of nanoscale SnO is constructed for the first time for this p-type oxide.
机译:在这里,我们报道了在低至180 C的温度下具有记录装置性能的纳米级(15 nm)全透明p型SnO薄膜晶体管(TFT)的制造。具体而言,通过仔细控制工艺条件,我们开发了霍尔迁移率为18.71 cm〜2 V〜(-1)s〜(-1)的SnO薄膜,并制造了线性场效应迁移率为6.75 cm的TFT器件。在透明的刚性和半透明的柔性基板上分别为〜2 V〜(-1)s〜(-1)和5.87 cm〜2 V〜(-1)s〜(-1)。这些迁移率值是迄今为止在这种低温下加工的任何p型氧化物的最高记录值。我们进一步证明了这种高移动性是通过仔细的相工程实现的。具体而言,我们表明纯相SnO不一定是最高迁移率相。取而代之的是,可以很好地控制残留金属锡的量,从而大大提高了空穴迁移率。首次为该p型氧化物构建了用于物理气相沉积纳米级SnO的详细相稳定性图。

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