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首页> 外文期刊>International Journal of Mechanical Sciences >Modeling and simulation of tool-chip interface friction in cutting Al/SiCp composites based on a three-phase friction model
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Modeling and simulation of tool-chip interface friction in cutting Al/SiCp composites based on a three-phase friction model

机译:基于三相摩擦模型切割Al / SICP复合材料工具芯片界面摩擦的建模与仿真

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Al/SiCp composite machining is considerably difficult owing to the presence of hard particles that result in complex friction at the tool-chip interface. To provide a more comprehensive understanding of the friction at the tool-chip interface in the machining of Al/SiCp composites, this study developed a three-phase friction model that considered the influence of matrix adhesion, two-body abrasion and three-body rolling. Then, to improve the accuracy of the simulation in Al/SiCp composite machining, a finite element (FE) model of randomly distributed round particles was developed by incorporating the three-phase friction model. The simulated chip formation and the cutting force based on the proposed FE model were compared to the experimental results and used to verify the three-phase friction model. The results indicated that two-body sliding, three-body rolling, and matrix sticking are three forms of contact that determined the tool-chip interface friction. The simulated values of the cutting force based on the proposed friction model follow a similar trend and were in good agreement with the experimental magnitudes. In addition, chip formation simulations at different stages in Al/SiCp composites machining were studied, and the chip morphology of the cutting simulation was consistent with the experiments that could be categorized as a saw-toothed chip.
机译:由于存在在工具芯片界面处具有复杂摩擦的硬颗粒存在,Al / SiCP复合材料加工显着困难。为了提供更全面的了解Al / SICP复合材料的加工过程中工具芯片界面的摩擦,这项研究开发了一种三相摩擦模型,认为基质粘附,双体磨损和三体轧制的影响。然后,为了提高AL / SICP复合材料加工中的模拟的准确性,通过结合三相摩擦模型开发了随机分布圆形颗粒的有限元(FE)模型。将基于所提出的Fe模型的模拟芯片形成和切割力与实验结果进行了比较,用于验证三相摩擦模型。结果表明,双体滑动,三体轧制和基质粘附是三种形式的接触,确定工具芯片界面摩擦。基于所提出的摩擦模型的切割力的模拟值遵循类似的趋势,与实验幅度吻合良好。此外,研究了Al / SiCP复合材料加工的不同阶段的芯片形成模拟,切割模拟的芯片形态与可以将其作为锯齿芯片分类的实验一致。

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