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首页> 外文期刊>International Journal of Mechanical Sciences >Research in minimum undeformed chip thickness and size effect in micro end-milling of potassium dihydrogen phosphate crystal
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Research in minimum undeformed chip thickness and size effect in micro end-milling of potassium dihydrogen phosphate crystal

机译:在磷酸二氢氢钾微终研磨中的最小未变形芯片厚度和尺寸效应的研究

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Highlights?A model of chip formation is developed to estimate the minimum undeformed chip thickness in micro-milling of KDP crystal.?The difference of normalized minimum undeformed chip thickness between KDP crystal and metallic materials is analyzed.?Severe size effect appears when feed per tooth is less than minimum undeformed chip thickness.?The feed per tooth which is slightly larger than minimum undeformed chip thickness and smaller than the cutting edge radius is recommended in micro-milling of KDP crystal or other soft-brittle crystal.AbstractMicro-milling is a promising approach to repair the micro-defects on the surface of potassium dihydrogen phosphate (KDP) crystal. However, KDP crystal is difficult to machine due to its properties of soft-brittle and easy deliquescence. This study investigates the minimum undeformed chip thicknesshmand the size effect in micro end-milling of KDP crystal by comprehensively analyzing cutting force, specific cutting force and machined surface quality. A model of the chip formation, which is capable of connecting the minimum undeformed chip thickness, the undeformed chip thickness and the periodicity of cutting force together, is developed to predict the value of minimum undeformed chip thickness. The normalized minimum undeformed chip thicknessλein terms of the ratio of the minimum undeformed chip thickness to the cutting edge radiusre, is estimated to be 0.43?≤?λe?≤?0.48. The significantly non-proportional increase of specific cutting force indicates the existence of size effects when the ratio of feed per tooth to cutting edge radiusft/reis less than 0.7. The machined surface quality also reflects severe size effect by the phenomenon that the micro cracks and brittle pits appear on the groove base, and the value of surface roughnessRais large when the ratioft/reis less than 0.5. Furthermore, the surface quality deteriorates and the brittle cutting appears when the ratioft/reis much larger than 1 which seems similar to macro-milling. The perfect machined surface with almost no ploughing effect and brittle cutting is achieved at a ratioft/reof 0.7. Therefore, a feed per tooth, slightly larger than the minimum undeformed chip
机译:<![cdata [ 突出显示 开发了芯片形成模型,以估计KDP晶体的微铣削中的最小未变形芯片厚度。 < / ce:list-item> 归一化的差异分析了KDP晶体和金属材料之间的最小未变形的芯片厚度。 每齿的饲料时出现严重尺寸效果小于最小的未变形芯片厚度。 < / ce:list> 摘要 Micro-Milling是一个有希望的方法修复二氢磷酸钾表面上的微缺陷(KDP)晶体。然而,由于其软脆和易潮解的性质,KDP晶体难以加工。本研究调查了最小的未变形芯片厚度 h m 和kdp crystal的微端研磨中的尺寸效应全面分析切割力,特定切削力和机加工表面质量。开发了一种能够将最小未变形芯片厚度,未变形的芯片厚度和切割力的周期性连接在一起的芯片形成模型,以预测最小未变形芯片厚度的值。归一化的最小未变形芯片厚度λ e 在最小未变形芯片厚度与切削刃的比率方面半径 r e ,估计为0.43?≤≤≤≤≤≤≤≤x≤≤x≤≤x≤≤x≤≤x≤≤x≤≤x_c:斜体>λ E ?≤?0.48。特定切割力的显着非比例增加表明,当每颗牙齿的饲料与切割边缘半径的比率 f / r E 小于0.7。加工表面质量也反映了微裂缝和脆弱凹坑在沟槽基座上出现的现象的严重尺寸效果,以及表面粗糙度的值 r A 当比率 f t / R e 小于0.5。此外,当比率 f / r E 远大于1,似乎类似于宏铣削。具有几乎没有耕作效果和脆性切割的完美加工表面,比率 f t / r E 为0.7。因此,每颗牙齿的饲料,略大于最小的未变形芯片

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