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Improving surface quality in microcutting of B-10/Al composite

机译:改善B-10 / Al复合材料微加工的表面质量

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Purpose The microcutting performance of the B-10/Al composite is significantly poor because of the existence of hard boron particles. The effects of cutting parameters, including uncut chip thickness and cutting speed, on the material removal mechanism and surface generation are investigated to improve the surface quality. Design/methodology/approach The 2D finite element model, which includes a rigid cutting tool, a reinforced phase, a matrix and a dense layer, is established. The effects of uncut chip thickness on material removal mechanism and surface generation are analyzed from a probabilistic perspective. The relationship between the uncut chip thickness and the probability in which the machined surface will have a better surface quality is constructed. A Gaussian distribution formula is applied to describe the machined surface quality. Findings Two representative particle-removal modes, namely, cutting-through and pulling-out modes, are observed. For cutting-through mode, when the relative cutting location is small, better surface quality is obtained. For pulling-out mode, the quality of the machined surface gradually improves because the further increase of the relative cutting location reduces the height of the generated pit and scratches. The microcutting at high cutting speed tends to suppress the scratch phenomenon. The best surface quality will be obtained at small uncut chip thickness and high cutting speed. Originality/value The surface quality generated in microcutting of the B-10/Al composite can be improved by optimizing the cutting parameters and controlling the particle-removal modes based on the proposed Gaussian distribution formula.
机译:目的由于硬硼颗粒的存在,B-10 / Al复合材料的微包性能显着差。研究了切削参数,包括未切割芯片厚度和切削速度,在材料去除机构和表面发生方面的影响,以提高表面质量。设计/方法/方法建立包括刚性切削刀具,增强相,基质和致密层的2D有限元模型。从概率的角度分析了未切割芯片厚度对材料去除机理和表面产生的影响。构造了未切屑芯片厚度与机加工表面具有更好的表面质量的概率之间的关系。应用高斯分布式公式来描述加工的表面质量。发现两个代表性颗粒去除模式,即拐点和拉出模式。对于截止模式,当相对切割位置小时,获得更好的表面质量。对于拉出模式,加工表面的质量逐渐提高,因为相对切割位置的进一步增加减小了产生的凹坑和划痕的高度。高切削速度的微包趋于抑制划痕现象。最佳表面质量将在小未切割芯片厚度和高切割速度下获得。通过优化基于所提出的高斯分布公式,通过优化切割参数并控制颗粒去除模式,可以提高在B-10 / Al复合材料的微加工中产生的表面质量。

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