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首页> 外文期刊>Current applied physics: the official journal of the Korean Physical Society >Analysis of current drift on p-channel pH-Sensitive SiNW ISFET by capacitance measurement
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Analysis of current drift on p-channel pH-Sensitive SiNW ISFET by capacitance measurement

机译:电容测量对P沟道pH敏感SINW ISFET的电流漂移分析

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The mechanism of drift effect in pH-sensitive silicon nanowire (SiNW) ion sensitive field effect transistor (ISFET) is comprehensively studied by measuring the time-dependent drain current (I-D) and the gate capacitance (C-G) under different liquid-gate biases (V(LG)s) and pH levels. It was revealed that the origin of the current drift can be divided into three different mechanisms; the bulk ionic diffusion in sensing insulator, the chemical modification of insulator surface, and the oxide etch process induced by hydroxide (OH-) ion. Based on the V-LG/pH dependency of current drift and the transient C-G variation, it is clearly recognized that the drift of n-type SiNW (n-SiNW) ISFET results from H+ thorn diffusion in the insulator, whereas that of p-type SiNW (p-SiNW) ISFET is caused by temporal chemical modification (hydration) of the insulator, along with the oxide thickness (t(ox)) reduction by OH- ions. (C) 2017 Elsevier B.V. All rights reserved.
机译:通过测量不同液态栅极偏置的时间依赖性漏极电流(ID)和栅极电容(CG),综合研究了PH敏感硅纳米线(SINW)离子敏感场效应晶体管(ISFET)的漂移效应机理。 V(LG)S)和pH水平。 据透露,目前漂移的起源可分为三种不同的机制; 传感绝缘体中的体离子扩散,绝缘体表面的化学改性,以及氢氧化物(OH-)离子诱导的氧化物蚀刻工艺。 基于电流漂移的V-LG / pH依赖性和瞬态CG变化,清楚地认识到,N型SINW(N-SINW)ISFET的漂移来自绝缘体中的H +刺扩散,而P- 型SinW(P-SINW)ISFET是由绝缘体的时间化学改性(水合)引起的,以及通过OH-离子的氧化物厚度(T(OX))。 (c)2017 Elsevier B.v.保留所有权利。

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