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Solution Processable Metal Oxide Thin Film Deposition and Material Growth for Electronic and Photonic Devices

机译:溶液加工金属氧化物薄膜沉积和电子和光子器件的材料生长

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摘要

A comprehensive review of recent advances in solution processing and growth of metal-oxide thin films for electronic and photonic devices is presented, with specific focus on precise solution-based technological coatings for electronics and optics, and new concepts for oxide material growth for electrochemical, catalytic, energy storage and conversion systems, information technology, semiconductor device processing and related devices. Throughout, the nature of the soluble precursors solutions and their relationship to film formation process by various solution coating techniques are collated and compared, highlighting advantages in precursor design for creating complex oxides for devices. Because of the versatility of solution-processable oxides and functional material coating, it is important to capture the advances made in oxide deposition for plastic electronics, see-through and wearable devices, and high-fidelity thin film transistors on curved or flexible displays. Solution processing, even for oxides, allows control over composition, thickness, optical constants, porosity, doping, tunable optical absorbance/ transmission, band structure engineering, 3D-substrate coating, complex composite oxide formation and multi-layered oxide systems that are more difficult to achieve using chemical vapor deposition (CVD) or atomic layer deposition (ALD) processes. We also discuss limitations of solution processing for some technologies and comment on the future of solution-based processing of metal-oxide materials for electronics, photonics and other technologies.
机译:介绍了电子和光子器件的溶液薄膜溶液加工和生长的全面审查,专注于精确的基于溶液的电子和光学技术涂料,以及用于电化学的氧化物材料生长的新概念。催化,能量存储和转换系统,信息技术,半导体器件处理和相关设备。整个各种溶液涂层技术的可溶性前体溶液的性质及其与膜形成过程的关系进行了比较,并突出了前体设计中的优点,用于为装置产生复杂氧化物。由于溶液可加工的氧化物和功能材料涂层的多功能性,重要的是捕获塑料电子,透视和可穿戴装置的氧化物沉积的进步,以及弯曲或柔性显示器上的高保真薄膜晶体管。即使对于氧化物,溶液加工允许控制组成,厚度,光学常数,孔隙率,掺杂,可调谐光学吸光度/传输,带结构工程,3D基板涂层,复合氧化物形成和多层氧化物系统更困难实现使用化学气相沉积(CVD)或原子层沉积(ALD)方法。我们还讨论了对某些技术的解决方案处理的限制,并评论了电子,光子和其他技术的金属氧化物材料的基于解决方案的处理的未来。

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