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Runtime Stress Estimation for Three-dimensional IC Reliability Management Using Artificial Neural Network

机译:使用人工神经网络的三维IC可靠性管理运行时应力估算

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摘要

Heat dissipation and the related thermal-mechanical stress problems are the major obstacles in the development of the three-dimensional integrated circuit (3D IC). Reliability management techniques can be used to alleviate such problems and enhance the reliability of 3D IC. However, it is difficult to obtain the time-varying stress information at runtime, which limits the effectiveness of the reliability management. In this article, we propose a fast stress estimation method for runtime reliability management using artificial neural network (ANN). The new method builds ANN-based stress model by training offline using temperature and stress data. The ANN stress model is then used to estimate the important stress information, such as the maximum stress around each TSV, for reliability management at runtime. Since there are a variety of potential ANN structures to choose from for the ANN stress model, we analyze and test three ANN-based stress models with three major types of ANNs in this work: the normal ANN-based stress model, the ANN stress model with hand-crafted feature extraction, and the convolutional neural network-(CNN) based stress model. The structures of each ANN stress model and the functions of these structures in 3D IC stress estimation are demonstrated and explained. The new runtime stress estimation method is tested using the three ANN stress models with different layer configurations. Experiments show that the new method is able to estimate important stress information at extremely fast speed with good accuracy for runtime 3D IC reliability enhancement. Although all three ANN stress models show acceptable capabilities in runtime stress estimation, the CNN-based stress model achieves the best performance considering both stress estimation accuracy and computing overhead. Comparison with traditional method reveals that the new ANN-based stress estimation method is much more accurate with a slightly larger but still very small computing overhead.
机译:散热和相关的热机械应力问题是三维集成电路(3D IC)开发的主要障碍。可靠性管理技术可用于缓解此类问题并提高3D IC的可靠性。然而,难以在运行时获得时变的应力信息,这限制了可靠性管理的有效性。在本文中,我们提出了一种使用人工神经网络(ANN)的运行时可靠性管理的快速应力估计方法。新方法通过使用温度和应力数据训练离线来构建基于ANN的压力模型。然后用于在运行时在运行时估计ANN应力模型来估计重要的应力信息,例如每个TSV周围的最大应力。由于有各种潜在的ANN结构可供ANN应力模型选择,我们在这项工作中分析和测试三种主要类型的ANN的基于ANN的压力模型:正常的基于ANN的压力模型,ANN应力模型用手工制作的特征提取,基于卷积神经网络 - (CNN)的应力模型。对每个ANN应力模型的结构和3D IC应力估计中的这些结构的功能进行了说明和解释。使用具有不同层配置的三个ANN应力模型来测试新的运行时应力估计方法。实验表明,新方法能够以极快的速度估计重要的压力信息,具有良好的运行时3D IC可靠性增强精度。尽管所有三个ANN应力模型都在运行时应力估计中显示了可接受的能力,但基于CNN的应力模型实现了考虑到应力估计精度和计算开销的最佳性能。与传统方法的比较表明,新的基于Ann的应力估计方法更准确,略大,但仍然非常小的计算开销。

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