Scattering of the SH wave from a crack in a piezoelectric substrate bonded to a half-space of functionally graded materials

摘要

The scattering of the SH wave from a crack in a piezoelectric substrate which is bonded to a half-space of functionally graded materials (FGM) is studied. The governing equations along with permeable crack boundary, regularity and continuity conditions across the interface are reduced to a coupled set of Cauchy singular integral equations which are solved approximately by applying Chebyshev polynomials. Numerical results for the normalized dynamic stress intensity factors (NDSIF) and the normalized electric displacement intensity factors (NEDIF) are presented. The effects of the geometric and physical parameters, and the effects of the frequency and the angle of incidence on NDSIF and NEDIF are discussed.