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The effect of grain size on the deformation mechanisms and mechanical properties of polycrystalline TiN: A molecular dynamics study

机译:晶粒尺寸对多晶锡变形机制和力学性能的影响:分子动力学研究

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The uniaxial tensile mechanical properties of polycrystalline TiN with 14 different grain sizes measuring 2.0-5.8 nm were studied via molecular dynamics with the second-nearest-neighbour modified embedded-atom method (2NN MEAM). The results show that the grain size affects the movement mechanisms of the grains and grain boundaries, and the relationship between grain size and tensile yield strength. The direct and inverse Hall-Petch formula of TiN are given. The dislocation migration of grain boundaries is the main deformation mechanism when the grain size is larger than 3.2 nm. When grains are smaller than 3.2 nm, grain rotation and grain boundary sliding are the preferred deformation mechanisms, which cause an inverse Hall-Petch effect. Polycrystalline TiN is at its hardest when the grain size ranges from 3 to 4 nm. The results can serve as theoretical basis for further doping non-metallic elements with critical grain sizes in the grain boundary produce superhard TiN composites. (C) 2017 Elsevier B.V. All rights reserved.
机译:通过使用第二最近邻改进的嵌入式原子方法(2NN MEAM),通过分子动力学研究了具有14种不同晶粒尺寸的多晶锡的单轴拉伸力学性能。结果表明,晶粒尺寸影响晶粒和晶界的运动机制,以及晶粒尺寸与拉伸屈服强度之间的关系。给出了锡的直接和逆露厅配方。晶界的脱位迁移是当晶粒尺寸大于3.2nm时的主要变形机制。当晶粒小于3.2nm时,晶粒旋转和晶界滑动是优选的变形机制,这导致逆霍尔竖起效应。当晶粒尺寸范围为3至4nm时,多晶锡最难。结果可以作为在晶界中具有临界粒度的进一步掺杂非金属元素的理论基础,从而产生超硬的锡复合材料。 (c)2017 Elsevier B.v.保留所有权利。

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