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Bayer MaterialScience:Integrated electronic modules in Baydur E PUR cases

机译:拜耳材料科技:Baydur E PUR机箱中的集成电子模块

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摘要

Bayer MaterialScience has developed a cheap one-step process for producing Baydur E PUR cases and encapsulating the electronic components,to further the protection of fragile electronic equipment.For the electronics industry,Bayer MaterialScience has perfected a polyurethane(PUR)material that is suitable for the most complex of shapes and is capable of rapidly filling hollow parts such as tiny ribs.The material,whose low processing temperatures and low shrinkage mean that it can encapsulate electronic components without damaging them,is an important development in PUR-RIM technology.
机译:拜耳材料科技开发了一种廉价的一步法来生产Baydur E PUR外壳并封装电子元件,以进一步保护易碎的电子设备。对于电子行业,拜耳材料科技已经完善了适用于以下用途的聚氨酯(PUR)材料: PUR-RIM技术是一种重要的发展,这种材料具有低的加工温度和低的收缩率,意味着可以封装电子元件而不损坏它们,而这种材料具有最复杂的形状,并且能够快速填充中空零件(例如微小的肋骨)。

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