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Regulating phase change behavior and surface characteristics of Sn15Sb85 thin film by oxygen doping

机译:通过氧气掺杂调节SN15SB85薄膜的相变行为和表面特征

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In this paper, oxygen doped Sn15Sb85 thin films were proposed to reduce the power consumption for phase change memory (PCM) application. Compared with Sn15Sb85, oxygen doped Sn15Sb85 thin film had higher crystallization temperature (168 degrees C-255 degrees C) and broader energy band gap (1.23-1.55 eV). X-ray diffraction patterns and transmission electron microscope showed that the crystallization of thin film was suppressed and grains became smaller when oxygen was added. After oxygen doping, the surface roughness decreased from 13.6 to 2.5m. Antimony oxide formed to enhance the thermal stability. In comparison to Ge2Sb2Te5, oxygen doped Sn15Sb85 had an ultra-fast phase transition speed (3.9 ns) confirmed by laser picosecond technology. The result of differential scanning calorimetry revealed that oxygen doped Sn15Sb85 had a lower melting temperature (494 degrees C). PCM cells based on the oxygen doped Sn15Sb85 thin film were fabricated to evaluate the electrical characteristics as well. The results indicated that the oxygen doped Sn15Sb85 thin film had great potentiality in PCM application.
机译:本文提出了氧气掺杂的SN15SB85薄膜,以减少相变存储器(PCM)应用的功耗。与SN15SB85相比,氧气掺杂的SN15SB85薄膜具有更高的结晶温度(168℃-255℃)和更宽的能带隙(1.23-1.55eV)。 X射线衍射图案和透射电子显微镜显示抑制薄膜的结晶,加入氧气时晶粒变小。氧气掺杂后,表面粗糙度从13.6降低到2.5米。形成氧化锑以增强热稳定性。与GE2SB2TE5相比,氧气掺杂的SN15SB85具有通过激光PICOSECOND技术确认的超快速相变速(3.9ns)。差扫描量热法的结果显示氧气掺杂的Sn15SB85较低的熔融温度(494℃)。基于氧气掺杂Sn15SB85薄膜的PCM细胞也被制造成评估电特性。结果表明,氧气掺杂的SN15SB85薄膜在PCM应用中具有很大的潜力。

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