<![CDATA[Structural and optical properties of (Ag <ce:inf loc='post'>x</ce:inf>Cu <ce:inf loc='post'>1-x</ce:inf>) <ce:inf loc='post'>2</ce:inf>ZnSnS <ce:inf loc='post'>4</ce:inf> thin films synthesised via solution route]]>
【24h】

xCu 1-x) 2ZnSnS 4 thin films synthesised via solution route]]>

机译:<![CDATA [(AG X 1-X 2> 2 ZNSN 4 薄膜通过解决方案路线合成]]>

获取原文
获取原文并翻译 | 示例
           

摘要

AbstractSilver (Ag) has been introduced in the quaternary compound Cu2ZnSnS4synthesised via solution chemistry. Thin films of the resulting pentanary alloys (AgxCu1-x)2ZnSnS4(0?≤?x?≤?1) show remarkable change in their microstructure and electronic properties with the increasing Ag content. Going from Cu2ZnSnS4(x?=?0) to Ag2ZnSnS4(x?=?1), the grain size increased from 0.13 to 2?μm which could be attributed to the liquid assisted grain growth mechanism. The optical band gap increased from 1.5 to 2.0?eV due to the influence of d-orbitals of Ag atoms on the valence band edge. The charge carrier density decreased by two orders of magnitude with only 4 atomic % Ag (x?=?0.04) incorporated in the films, which can be attributed to the reduction in the density of CuZnand VCupoint defects with Ag atoms occupying the Cu-sublattice sites. Also, with increasing Ag content the lattice parametersaandbincreased from 5.42 to 5.82??, whereas there was negligible change in the lattice parameterc.Highlights?A simple solution route for the fabrication of (AgxCu1-x)2ZnSnS4thin films.?Grain size, optical band gap dramatically increase with the increased Ag amount.?Lattice constant a (and b) increases with the increase Ag amount.?Tuning band gap, charge-carrier density, mobility of CZTS thin film.]]>
机译:<![CDATA [ 抽象 Silver(AG)已在第四纪化合物CU 2 znsns 4 通过溶液化学合成。由此产生的戊烷合金的薄膜(AG X CU 1-X 2 ZNSN 4 (0?≤≤x≤x≤≤x≤1)显得的微观结构和变化电子特性随着AG含量的增加。来自CU 2 ZNSN 4 (X?=?0)到AG 2 ZNSN 4 (X?=?1),晶粒尺寸从0.13增加到2?μm这可能归因于液体辅助晶粒生长机制。由于AG原子对价带边缘的影响,光带间隙从1.5到2.0增加到2.0°。电荷载体密度减少了两种数量级,只有4个原子%Ag(x≤x≤0.04),其可以归因于Cu 和v cu point缺陷与agematics占用Cu-Sublattice站点。此外,随着AG含量的增加,晶格参数 a b 从5.42增加到5.82 ??,而晶格变化可以忽略不计参数 c 突出显示 制造的简单解决方案路由(AG X CU 1-x 2> 2 znsns 4 薄膜。 粒度,op. Cutica带隙随着Ag的增加而显着增加。 < CE:PARA ID =“P0020”View =“全部”>晶格常数A(和B)随着增加的AG金额而增加。 调谐带隙,充电载波密度,czts薄膜的移动性。 ]]>

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号