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Microstructural and mechanical characterization of Stellite-hardfaced coatings with two types of buffer layers

机译:具有两种缓冲层的星形硬粘接涂层的微观结构与力学特性

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摘要

In recent years, a major challenge facing the power generation industry is delamination of Stellite-hardfaced coatings from high-temperature valves. In order to meet this challenge, IN82 buffer layer was evaluated to replace the problematic S21 buffer layer. S6 and either S21 or IN82 hardfacing alloys were deposited onto F91 steel substrates using plasma-transferred arc hardfacing. Aging was conducted at temperatures between 550 and 650 degrees C for three exposure durations within a one-year period. A comparative study was carried out on the microstructure and mechanical properties of IN82 and S21 hardfaced specimens. The F91/S21 interface is unstable during aging because a hard and brittle interfacial layer grows, which significantly reduces the impact energy of S21 hardfaced specimens. In contrast, the F91/IN82 interface is microstructurally much more stable than the F91/S21 interface; an interfacial band, part of the F91 steel, and some discrete M23C6 carbides along this band grow during aging at 650 degrees C for 8760 h. The impact energy loss of the IN82 specimens is much less significant than that of the S21 specimens. Moreover, the toughness degradation is not related to the F91/IN82 interface, but rather to coarsening and precipitation of the intergranular/interdendritic carbides in the IN82 bulk material during aging. To conclude, the IN82 buffer layer is a good alternative to replace the problematic S21 buffer layer, enhancing the durability of the S6 coating components. However, the hardness of the S6 top layer is compromised due to dilution of Fe and Ni. To maintain its hardness, more S6 layers can be deposited and process optimization can be undertaken to reduce dilution in the applications where wear resistance is critical.
机译:近年来,发电行业面临的主要挑战是从高温阀门中分层脱毛硬化的涂层。为了满足这一挑战,评估IN82缓冲层以替换问题的S21缓冲层。使用等离子体转移的弧形硬坯沉积S6和S21或In82硬折叠合金在F91钢基板上。在一年内,在550至650℃的温度下在550至650℃的温度下进行老化。对比较研究进行了在IN82和S21硬漂样标本的微观结构和机械性能下进行。在老化期间F91 / S21接口是不稳定的,因为硬质且脆性界面层增长,这显着降低了S21硬敷样品的冲击能量。相比之下,F91 / IN82接口比F91 / S21界面更加稳定;沿650℃的老化在8760小时的老化期间,F91钢的界面频段和一些离散的M23C6碳化物在衰老期间生长。 IN82标本的冲击能量损失远非显着显着显着显着的标本。此外,韧性降解与F91 / IN82界面无关,而是在老化期间在IN82散装材料中串联和沉淀晶间/蛋白质碳化物。为了得出结论,IN82缓冲层是更换问题的S21缓冲层的良好替代方案,增强S6涂层组分的耐久性。然而,由于稀释Fe和Ni,S6顶层的硬度受损。为了保持其硬度,可以沉积更多S6层,可以进行处理优化,以减少耐磨性至关重要的应用中的稀释。

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