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Enhancement of discharge and deposition rate in dual-pulse pulsed magnetron sputtering: Effect of ignition pulse width

机译:双脉冲磁控溅射中的放电和沉积速率的增强:点火脉冲宽度的影响

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摘要

To increase deposition rate during pulsed magnetron sputtering (PMS), a novel dual-pulse pulsed magnetron sputtering (DP-PMS) was proposed. The discharge mode of DP-PMS firstly produced a pulsed high ignition voltage with short duration followed by a subsequent pulsed low work voltage with long duration. CrN coatings were deposited by DP-PMS and PMS. The effect of ignition pulse width of DP-PMS on the discharge of Cr target in argon and the deposition rate of CrN coatings was explored. The target current of DP-PMS was featured by an initial peak, which was different from the triangular waveform in PMS. The DP-PMS with a longer ignition pulse produced a higher substrate current and a larger number of Cr-0 at unit target power. There existed a proper width of initial ignition pulse (e.g. 15 us) producing the maximum deposition rate at unit target power, which was nearly four times higher than that of PMS.
机译:为了在脉冲磁控溅射(PMS)期间增加沉积速率,提出了一种新型的双脉冲脉冲磁控溅射(DP-PMS)。 DP-PM的放电模式首先产生具有短持续时间的脉冲高点火电压,然后具有长时间的随后的脉冲低功率。 通过DP-PMS和PMS沉积CRN涂层。 探讨了DP-PMS对氩气中Cr靶排出的点火脉冲宽度及CRN涂层沉积速率的影响。 DP-PM的目标电流由初始峰特征,其与PMS中的三角波形不同。 具有较长点火脉冲的DP-PM在单位目标功率下产生更高的基板电流和更大数量的CR-0。 存在适当的初始点火脉冲宽度(例如15 US),在单位目标功率下产生最大沉积速率,其比PMS高几乎四倍。

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