机译:双脉冲磁控溅射中的放电和沉积速率的增强:点火脉冲宽度的影响
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol Sch Mat Sci &
Engn Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Peking Univ Shenzhen Grad Sch Sch Adv Mat Shenzhen 518055 Peoples R China;
Dual-pulse pulsed magnetron sputtering; Deposition rate; Ignition pulse; Pulse width; CrN coating;
机译:双脉冲磁控溅射中的放电和沉积速率的增强:点火脉冲宽度的影响
机译:一种提高大功率脉冲磁控溅射沉积速率的新型脉冲方法
机译:大功率脉冲磁控溅射沉积中的沉积速率
机译:通过脉冲DC反应磁控溅射制备的光诱导亲水性TiO_2薄膜的增强沉积速率
机译:用于微辐射热计应用的脉冲直流磁控溅射氧化钒薄膜的制备,表征和沉积后修饰
机译:磁控溅射与TiO2和BFCO薄膜的脉冲激光沉积相结合
机译:大功率脉冲磁控溅射沉积中的沉积速率