A novel pulsing method for the enhancement of the deposition rate in high power pulsed magnetron sputtering

摘要

A novel pulsing technique has been proposed to enhance the deposition rate of film in high power Pulsed magnetron sputtering (HPPMS). The detailed investigations on the temporal behavior of the plasma density have been done. The results have provided a clue to it: a temporal discrepancy between the cathode voltage and the peak plasma density. The experimental results showed that the novel pulsing technique significantly enhanced the sputtering rate. Finally, we could obtain the deposition rate of titanium film more than two times higher than that in the conventional HPPMS by using the new pulsing technique.