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Process stabilization and enhancement of deposition rate during reactive high power pulsed magnetron sputtering of zirconium oxide

机译:反应性高功率脉冲磁控溅射氧化锆过程中的工艺稳定性和沉积速率的提高

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摘要

Reactive high power pulsed magnetron sputtering (HPPMS) of zirconium oxide exhibits a stable and hysteresis-free transition zone, as opposed to reactive direct current magnetron sputtering (dcMS). The stabilization of the transition zone in HPPMS facilitates the growth of transparent zirconium oxide films at lower target coverage, in comparison to dcMS. The lower target coverage, in turn, allows for film deposition rates up to 2 times higher than those achieved by dcMS. The mechanisms which lead to the process stabilization in reactive HPPMS are discussed. (c) 2008 Elsevier B.V. All rights reserved.
机译:与反应性直流磁控溅射(dcMS)相反,氧化锆的反应性高功率脉冲磁控溅射(HPPMS)表现出稳定且无滞后的过渡区。与dcMS相比,HPPMS中过渡区的稳定有助于在较低的目标覆盖率下生长透明的氧化锆薄膜。较低的目标覆盖范围又可以使薄膜沉积速率比dcMS所获得的高出2倍。讨论了导致反应性HPPMS中过程稳定的机制。 (c)2008 Elsevier B.V.保留所有权利。

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