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the deposition of ti1 - xalxn using bipolar pulsed dual magnetron sputter deposition

机译:双极脉冲双磁控溅射沉积Ti1-Xalxn的沉积;

摘要

Method for manufacturing a metal cutting tool comprising depositing a hard and wear resistant refractory coating comprising compounds of which at least one layer consists of a multilayered MX/LX/MX/LX laminar structure where the alternating layers MX and LX are carbides or nitrides with the elements M and L selected from the group consisting of Ti, Nb, Hf, V, Ta, Mo, Zr, Cr, Al, Si or W and mixtures thereof, of which at least one of MX or LX are electrically isolating, and that the other layer(s) comprise(s) wear resistant nitrides, carbides, oxides and/or carbonitrides as known in the art, onto a substrate. Reactive Bipolar Pulsed Dual Magnetron Sputtering (BPDMS) technique using magnetron pairs comprising either one M element target and one L element target or using magnetron pairs with two targets of the same element, arranged so that one target in the magnetron pair acts as anode and the other target acts as cathode and vice versa are used for the deposition.
机译:一种金属切削工具的制造方法,包括沉积一种硬质耐磨耐火涂层,该涂层包括至少一层由多层MX / LX / MX / LX层状结构组成的化合物,其中交替层MX和LX为碳化物或氮化物,且选自Ti,Nb,Hf,V,Ta,Mo,Zr,Cr,Al,Si或W以及它们的混合物的元素M和L,其中至少一个是MX或LX是电绝缘的,并且其他层在基底上包括本领域已知的耐磨氮化物,碳化物,氧化物和/或碳氮化物。反应双极脉冲双磁控溅射(BPDMS)技术使用包括一个M元素标靶和一个L元素标靶的磁控管对,或使用具有相同元素的两个标靶的磁控管对布置,以使磁控管对中的一个标靶充当阳极,并且其他靶作为阴极,反之亦然。

著录项

  • 公开/公告号SE0402180D0

    专利类型

  • 公开/公告日2004-09-10

    原文格式PDF

  • 申请/专利权人 SANDVIK AB;

    申请/专利号SE20040002180

  • 申请日2004-09-10

  • 分类号C23C;

  • 国家 SE

  • 入库时间 2022-08-21 23:07:38

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